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Integrated Driver & MOSFET | FDMF5175

30A Smart Power Stage (SPS) Modules with Integrated Current and Temperature Monitors

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Overview

The FDMF5175 is ON 小蓝俱乐部鈥檚 next generation of Smart Power Stage (SPS) solution with fully optimized, ultra鈭抍ompact, integrated MOSFETs plus driver for high鈭抍urrent, high frequency, and synchronous buck DC鈭扗C converters.
With an integrated approach, the SPS switching power stage is optimized for driver and MOSFET dynamic performance, minimized system inductance, and power MOSFET RDS(ON).
The integration of Power MOSFETs with a driver IC also enables advanced high accuracy module thermal and current monitoring. The FDMF5175 provides an output signal (IMON), which reports the real鈭抰ime module current. The IMON signal can be used to replace inductor DCR current sense or resistor sense methods. There is also accurate thermal monitoring (TMON) that provides a 0.8 V output at 25掳C with an 8 mV / 掳C slope.

  • Multiphase and Single Phase DC-DC Voltage Regulators
  • Server, Storage Systems, Computing
  • Communications Infrastructure Systems
  • Graphics Cards, Enterprise Switches

  • Server, Storage Systems, Computing

  • Up to 30A Peak Current Handling Capability
  • High-Performance, Universal Footprint, Copper-Clip 4 mm x 5 mm PQFN Package
  • ON 小蓝俱乐部's PowerTrench庐 MOSFETs for Clean Voltage Waveforms and Reduced Ringing
  • 30V / 25V Breakdown Voltage MOSFETs for Higher Long Term Reliability
  • Optimized FET Pair for Highest Efficiency at 10% ~ 15% Duty Cycle
  • Optimized for Switching Frequencies up to 1 MHz
  • Integrated Current Monitor (IMON)
  • Integrated Temperature Monitor (TMON)
  • Catastrophic Fault Detection
  • Thermal Flag (OTP) for Over-Temperature Condition
  • Over-Current Protection Fault(OCP)
  • High-Side Short Detect Fault
  • Under-Voltage Lockout (UVLO) on VCC
  • ON 小蓝俱乐部 Green Packaging and RoHS Compliant

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FDMF5175

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Active

CAD Model

Pb

A

H

P

PQFN-24

483BV

1

260

REEL

3000

N

5

12

3.3V, 5V

30

1

$1.4333

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Reliability Data

Die Related Summary Data

Device: FDMF5175

Equivalent to wafer fab process: 29,RN

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

29,RN

0

129145414

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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